Electron Microscope Facility
Electron microscopy is acknowledged as one of the most useful methods for materials characterization at sub-micron microstructural length scales. It is an essential component in all materials development programs in which materials microstructure-properties-processing relationships are probed. At Brown University, this approach is taken in studies of a wide spectrum of materials systems ranging from structural materials such as ceramic, metal matrix, and other composites to electronic materials such as GaN, GaAs, SiC, and ZnSe to name a few. In both electronic and structural materials technologies there is an emerging recognition of the importance of an improved understanding of materials behavior at the nanometer length scale. This trend, shared by both the electronic and structural materials communities, is driven in the microelectronics area by improved lithographic technologies that allow device fabrication with 0.25 micron feature sizes and the technological promise of novel electronic materials with tailored properties based on quantum confinement effects. In the structural materials arena, theory, computation, and experiment reveal that improved understanding of mechanical behavior at the nanometer length scale provides an opportunity to develop new materials with increased toughness, ductility and high temperature strength.
The electron microscope facility is used for instructional purposes at the graduate and undergraduate levels and in the research of over 25 graduate students, faculty, and staff who are associated with a wide variety of multi-investigator research projects. These investigators represent many different departments and research groups including Materials Science, Solid Mechanics, and Electrical Sciences in the Division of Engineering, as well as Physics, Chemistry, and Geology. The Electron microscope facility is operated as a cost-center and is administered by the Institute for Molecular and Nanoscale Innovation to provide support for service contracts, supplies, and day-to-day maintenance of the equipment. The current director of the facility is Professor David C. Paine and the facility supports a full-time research engineer, Tony McCormick, who provides instruction to new users and participates in a variety of research projects. The IMNI Electron Microscope Facility receives support from many IMNI block grants, such as:
- The MRSEC/NSF under Award No. DMR-0079964;
- MURI2000/AFOSR under Award No. F49620-00-1-0331;
We would appreciate your acknowledgement in your reports and publications.
For further information contact:
David C. Paine
Professor, Division of Engineering
Director, Electron Microscope Facility
Phone: (401) 863-1457
Box D, Brown University
Electron Microscope Equiment
The laboratory instrumentation consists of:
- Transmission Electron Microscopes,
- Scanning Electron Microscopes,
- Beam blanking and e-beam writing accessories for high resolution lithography,
- Sample preparation facilities,
- Image processing facilities.
Optical and atomic force microscopes are also available. Features of shared MRSEC microscopes are outlined below.
Click here for current rates for outside MRSECs.
JEOL JEM-2010 TEM: The JEM 2010 is a 200 kV, high-resolution/analytical hybrid insrument, capable of .19 nm point-to-point resolution. It is equipped with an x-ray spectrometer, a parallel electron energy loss spectrometer (PEELS), a high-resolution, CCD camera system, and a high-resolution TV-rate camera. A high-temperature single-tilt holder (1300 C maximum) is used in situ experimental observations.
Phillips EM-420 TEM/STEM: The EM-420 is a 120 kV analytical TEM, equipped with an x-ray spectrometer, and energy loss spectrometer, and a low-temperature double tilt holder. This instrument has a goniometer with a tilt range of +/- 60 degrees. This is invaluable for defect analysis and structural analysis by convergent beam diffraction.
LEO 1530: The LEO 1530 is a high-resolution SEM equipped with a field emission source. Resolution of 1.5 nm is obtainable. This instrument has excellent capability for low-voltage imaging, which is particularly important for examining insulating materials.
JEOL JSM 845: The JSM-845 has a resolution of 4.0 nm and a chamber that can accept 6'' wafers. It is equipped with an energy dispersive x-ray spectrometer for compositional analysis and an EBSP (electron backscatter pattern) system for orientation imaging. EBSP provides rapid crystallographic orientation of all grains on the surface of the specimen.
Both scanning electron microscopes are equipped with e-beam writing capabilities for high-resolution lithography.
Sample Preparation: Extensive facilities are available for preparing TEM specimens of metals, ceramics, and semiconductors. A partial list of equipment includes: jet polisher, ion mills, polishing benches, dimpler, high and low speed diamond saws, and carbon evaporator.
Image Processing: Image processing capabilities currently include: a DEC 5000 workstation, a Macintosh IIfx interfaced with the JSM 2010, and an IBM PC with a network link to a DEC file server. Software includes the JCPDS diffraction files and programs for diffraction analysis. The DEC station also features software for image processing simulation.